| Part Numbert | Mfg | Packt | D/C | Descriptiont | Qty | Company/Contact | |
| 74LVC1G125DCKR | ti | dc08+ | 1124 |
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| 74LVC1G125DCKR | ti | IN STOCK!P | dc01 | 1124 |
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| 74LVC1G125DCKR | ti | dc01 | IN STOCK!Pack: 3000/ | 1124 |
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| 74LVC1G125DCKR | ti | dc01 | IN STOCK!Pack: 3000/ | 1124 |
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| 74LVC1G125DCKR | ti | IN STOCK!P | dc01 | 1124 |
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| 74LVC1G125DCKR | ti | IN STOCK! | dc01 | 1124 |
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| 74LVC1G125DCKR | 31000 | TI |
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| 74LVC1G125DCKR | ti | 1124 |
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| 74LVC1G125DCKR | ti | dc01 | IN STOCK! pack: 3000 | 1124 |
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| 74LVC1G125DCKR | ti | dc01 |
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| 74LVC1G125DCKR | ti | dc01 | INSTOCK!vpe:3000/tr/ | 1124 |
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74LVC1G125DCKR Datasheet
74LVC1G125DCKR Price Mounting: Heat sink flatness must be less than 50 pm (a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended forlow thermal contact resistance and to reduce the bending stress on the ceramic substrate caused by the temperature difference to the heat sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 t0 0.6 Nm. 74LVC1G125DCKR on stock These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 2.4 2.7 3 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 |
