. Place the TVS near the input terminals or connectors to restrict transient coupling. . Minimize the path length between the TVS and the protected line. . The ESD transient return path to ground should be kept as short as possible. . Place a TVS & decoupling capacitor between power and ground of components that may be vulnerable to electrostatic discharges to the ground plane. . Minimize all conductive loops including power and ground loops. . Use multilayer boards when possible. . Minimize interconnecting line lengths . Never run critical signals near board edges. . Fill unused portions of the PCB with ground plane.
AD404M166RBA-5 Price| | 1.0 | | | | | | | | | | | |
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AD404M166RBA-5 on stock| Junction - soldering point l) | RthjS | 145 | K/W |
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| | | TA= OIC | TA= +25IC | TA= +85IC | | |
| Symbol | Parameter | Min | Typ. | Max | Min | Typ. | Max | Min | Typ. | Max | Unit | Condition |
| tPLH tPHL | Propagation Delay to Output D SEL | 225 400 | 385 600 | 550 775 | 225 400 | 385 600 | 550 775 | 225 400 | 385 600 | 550 775 | ps | |
| tskew | Within-Device Skew | | 60 | | | 60 | | | 60 | | ps | 1 |
| tr tf | Rise/Fall Time 20% t0 80% | 275 | 425 | 650 | 275 | 425 | 650 | 275 | 425 | 650 | ps | |
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