| Symbol Name Type Function |
| AO-A17 | Address Inputs Input Address Inputs are internally latched during write cycles. |
| DO-D15 | Data Input/Outputs are internally latched on write cycles. Data Input/Output Input/Output Data outputs are latched during read cycles. Data pins are active high. When the memory card is de-selected or the outputs are disabled the outputs float to tri-state. |
| CEi, CE2 | Card Enable is active low. The memory card is de-selected and power consumption is reduced to standby levels when CE is high. CE activates the internal Card Enable Input memory card circuitry that controls the high and low byte control logic of the card, input buffers, segment decoders, and associated memory devices. |
| OE | Output Enable is active low and enables the data buffers Output Enable Input through the card outputs during read cycles. |
| WE | Write Enable is active low and controls the write function to the memory array. The target address is latched on the Write Enable Input falling edge of the WE pulse and the appropriate data is latched on the rising edge of the pulse. |
| Vcc | PC Card Power PC Card Power Supply for device operation Supply (5.OV + 5%) |
| GND | Ground Ground |
| CDi, CD2 | . When Card Detect l and 2 = Ground the system detects Card Detect Output ' the card. |
| WP | . Write Protect is active high and indicates that all card Write Protect Output ' write operations are disabled by the write protect switch. |
| NC | No Connect Corresponding pin is not connected internally. |
| BVDi, BVD2 | Battery Voltage Detect Output Internally pulled up. (There is no battery in the card.) |
| REG | Provide access to Card Information Structure in the Register Select Input Attribute Memory Device |
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Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 500C before cleaning.
