| Part Numbert | Mfg | Packt | D/C | Descriptiont | Qty | Company/Contact | |
| AM26L32ACN | AMD | 100 |
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| AM26L32ACN | TI | DIP | 08+ | in Stock | 1654 |
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| AM26L32ACN | TI | ★★★★★parts in room,n | 42 |
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| AM26L32ACN | TI | 95 |
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| AM26L32ACN | TI | 42 |
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| AM26L32ACN | TI | 08+ | 原装热卖现货 | 9120 |
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| AM26L32ACN | TI | DIP | 21 |
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| AM26L32ACN | 21 |
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| AM26L32ACN | TI | DIP | 21 |
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| AM26L32ACN | AMD | N/A | 04+ | 2920 |
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AM26L32ACN Datasheet Fig.l Power dissipation / collector power Fig.2 Forward current vs. forward voltage Fig.3 Collector current vs. forward current dissipation vs. ambient temperature AM26L32ACN Price o L r ) o L O o L r ) o L O - t 4 c o V ) ~ l ( - l ( A ) I n o A ' O V i O A i f l d i f l 0 AM26L32ACN on stock . 3.5A, 30V . rDS(ON) = 0.060l . Temperature Compensating PSPICE~ Mode . Peak Current vs Pulse Width Curve . UIS Rating Curve . Related Literature NOTES: 1. Absolute maximum ratings apply to both DICE and packaged parts, unless olherwise noted. 2. OLA-'S specified for worSt case mounting conditions. i.e., ej, dei:ice in sockat for TO. CerDIP. P-DIP. and ,CC packa_C:g'glp ::S S~S:"eafjfoC; far device soldered to printed circuit board for SO and PLCC . v 1F 77 . EQ 7 y7 [lstS JF] . lst S IF [SIF ] .7iv7-SIF3 :11\- ~7 |