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Layout Considerations The MAX2027 evaluation board can be a guide for your board layout. Pay close attention to thermal design and close placement of parts to the lC. The MAX2027 pack- age exposed paddle (EP) conducts heat from the part and provides a low-impedance electrical connection. The EP must be attached to the PC board ground plane with a low thermal and electrical impedance con- tact. Ideally, this can be achieved by soldering the backside package contact directly to a top metal ground plane on the PC board. Alternatively, the EP can be connected to a ground plane using an array of plated vias directly below the EP.