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Part Numbert	Mfg	Packt	D/C	Descriptiont	Qty	Company/Contact
ECQE6104JFW	PAN		07+		23000	DUO JIE ELECTRONICS ( HK) Limi.. Contact:Sandy Tel:86-755-82887416 Fax:86-755-82886465 Email: sales@hkduojie.com

ECQE6104JFW Datasheet

Fig.2 : Correlation between maximum RMS power dissipation and maximum allowable temperatures (Tamb and Tcase) for different thermal resistances heatsink + contact (BTA).
ECQE6104JFW Price

COMMON EMITTER VCE =1V						f	J
COMMON EMITTER VCE =1V						\|	\|
	Tn	=10	DoC	\|j	5f	j\|	\| -25
		=10	DoC	\|j	5f	j\|	\| -25
					l
				J		I
			l	i

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j
	j

		j

			j	0 25 50 75 100 125 150	AMBIENT TEMPERATURE Ta (oC)

Ta=100C
Ta ra=-2s	=25C 'C
		VCE =-5V
		VCE =-5V

Soldering Precautions The soldering process creates a considerable thermal stress on any semiconductor component. The melting temperature of solder is higher than the maximum rated temperature of the device. The amount of time the device is heated to a high temperature should be minimized to assure device reliability. Therefore, the following precautions should always be observed in order to minimize the thermal stress to which the devices are subjected.

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