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| Part Numbert | Mfg | Packt | D/C | Descriptiont | Qty | Company/Contact | |
| LLS2G221MELA | NICHICON | 2009 | 19160 |
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| LLS2G221MELA | NICHICON | 2008 | 19160 |
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| LLS2G221MELA | NICHICON | 08+ | 6000 |
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| LLS2G221MELA | nichicon | 2009 | 120300 |
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| LLS2G221MELA | NICHICON | 07+ | 60000 |
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| LLS2G221MELA | Nichicon | 07+ | ORI,ROHS,7DAYS | 6000 |
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| LLS2G221MELA | Nichicon | 2008+ | 6500 |
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| LLS2G221MELA | NICHICON | 07+ | DIP |
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LLS2G221MELA Datasheet
LLS2G221MELA Price Wben METALSW is floaLing, metal-tape mode is selected. METALl ancl METAL2 are grounded inter- nally through 3.9 kQ resistors, adjusting the negative feedback nel:work to provide metal-tape playback equal- izaiion. LLS2G221MELA on stock GND (Pins 2/4): System Ground. The low power internal circuitry returns to this pin in the 16-pin packages. GND and PGND are bonded together to this pin in the S0-8. Intersil's unique CMOS chopper-stabilized amplifier circuitry is user-transparent, virtually eliminating the traditional chopper amplifier problems of intermodulation effects, chopping spikes, and overrange lockup. Dimensions in parenthesis are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch). METALLIZATION: Thickness: 11kA - 14kA, AL. PASSIVATION: 10.4kA - 15.6kA, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches |