| Part Numbert | Mfg | Packt | D/C | Descriptiont | Qty | Company/Contact |
MX584TQ-HR MX584TQ-HR MX584TQHR Datasheet
MX584TQ-HR MX584TQ-HR MX584TQHR Price . 32, 64, 128 0r 256 elements (RL0032M, RL0064M, RL0128M, and RL0256M respectively) - 100 ym spacing . On-chip bonding pad suitable for wire bonds or flip-chip bonds . Photodiode with each bonding pad for optical testing . Standard and mirror images available for interdigitated lin- ear array . Low power requirements . Diode reset feature . Dummy video output for fixed pattern cancellation . Low output video line capacitance MX584TQ-HR MX584TQ-HR MX584TQHR on stock The oscillator, control circuitry, and four power MOSFET switches are included on-chip. The charge pump runs continuously at the operating frequency. During one-half of the oscillator period, switches Sl and S2 close (Figure 2), charging the transfer capacitor (CFLY) to the input voltage (CAP- = GND, CAP+ = IN). During the other half cycle, switches S3 and S4 close (Figure 3), transferring the charge on CFLY to the output capacitor (CAP+ = GND, CAP- = OUT). '1. It specifies the maxmum distance between emitter and detector that the output wave form satisfies the standard under the conditions below against the standard transmitter. 1) Measuring place : Indoor without extreme reflection of light 2) Ambient light source : Detecting surface illumination shall be irradiate 200+501x under ordinary white fluorescence lamp without high frequency lightning 3) Standard transmitter : Burst wave of standard transmitter shall be arranged t0 50mVP-P under the measuring circuit |
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