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MX7531KCWN Datasheet
Mechanical Shock Per Mil-STD-883 D, Method 2 002.3 _ 500 1 msec, Half Sine, mounted to a fixture
MX7531KCWN Price
To effect assembly/disassembly of the next received/transmitted character, MR12 - 15 must be changed within n bit times of the active going state of / DY. Transparent and non-transparent mode changes (MR16) must occur within n-l bit times of the character to be affected when the receiver or transmitter is active. (n - smaller of the new and old character lengths.)
MX7531KCWN on stock

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Characteristic (One Junction Heated) Symbol Max Unit
Total Device Dissipation TA = 25IC Derate above 251C PD 187 (Note l.) 256 (Note 2.) 1.5 (Note l.) 2.0 (Note 2.) mW mW/IC
Thermal Resistance - Junction-to-Ambient ROJA 670 (Note l.) 490 (Note 2.) IC/W
Characteristic (Both Junctions Heated) Symbol Max Unit
Total Device Dissipation TA = 25IC Derate above 25YC PD 250 (Note l.) 385 (Note 2.) 2.0 (Note l.) 3.0 (Note 2.) mW mW/IC
Thermal Resistance - Junction-to-Ambient ROJA 493 (Note l.) 325 (Note 2.) Yc/w
Thermal Resistance - Junction-to-Lead ROJL 188 (Note l.) 208 (Note 2.) IC/W
Junction and Storage Temperature Tj, Tstg - 55 to +150 IC