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PAL16L8-12CFN Datasheet

mm inch
DIM MIN TYP MAX MIN TYP MAX
A 5.35 5.65 0210 0222
c 3.3 3.8 0.130 0.149
D 2.9 3.1 0.114 0.122
D1 1.88 2.08 0.074 0.081
E 075 1 0.029 0.039
F 1.05 1.25 0.041 0.049
G 10.8 11.2 0.425 0.441
H 15.8 16.2 0.622 0.637
L1 20.8 21.2 0.818 0.834
L2 19.1 19.9 0752 0783
L3 22.8 23.6 0.897 0.929
L4 40.5 42.5 1.594 1.673
L5 4.85 5.25 0.190 0206
L6 2025 20.75 0797 0.817
M 3.5 3.7 0.137 0.145
N 2.1 2.3 0.082 0.090
U 4.6 0.181


PAL16L8-12CFN Price

Parameters 16TTS.. Units Conditions
IT(AV, Max.AverageOn-stateCurrent 10 A @ Te = 980 C,1800 conduction halfsine wave
IRMS Max.RMSOn-stateCurrent 16
ITSM Max.PeakOneCycleNon-Repetitive 170 1 0msSine pulse, rated VRRMapplied
SurgeCurrent 200 1 0msSine pulse, novoltagereapplied
12t Max.12tforfusing 144 A2S 1 0msSine pulse, rated VRRMapplied
200 1 0msSine pulse,novoltagereapplied
12 et Max.12 ftforfusing 2000 A2 t= 0.1 t010ms, novoltage reapplied
VTM Max.On-stateVoltageDrop 1 4 V @10A,Tj = 250C
On-state slope resistance t 24 0 m Ti= 1250C
VT(TO) Threshold Voltage 1 1 V
IRWI/IDM Max.Reverse and Direct 0 5 mA Ti=25 0C
LeakageCurrent 10 T= 125 0C VR = rated VRRM/ VDRM
IH Holding Current Typ Max Anode Supply = 6V, Resistive load, Initial IT=1A
100 mA 16TTS08,16TTS12
100 150 16TTS16
IL Max.LatchingCurrent 200 mA AnodeSupply=6V,Resistiveload
dv/dt Max. Rate of Rise of off-state Voltage 500 VUS
di/dt Max. Rate of Rise ofturned-on Current 150 A/ps


PAL16L8-12CFN on stock

SPECIFICATNONSa
Test Conditions Unless Otherwise Specified Limits D Suffix -40 t0 850C
Parameter Symbol DISCHARGE = -VIN = 0 V Vcc = 10 V, +VIN = 48 V RBIAS = 390 kQ, RoSc = 330 kQ Tempb Mind Type Maxd Unit
Error Amplifier
Output Current IOUT Sink (VFB = 4.5 V) Room 0.12 0.15 mA
Power Supply Rejection PSRR 9.5 V i Vcc i 13.5 V Room 50 70 dB
Current Limit
Threshold Voltage VSOURCE RL = 100 Q from DRAIN to Vcc VFB=OV Room 1.0 1.2 1.4 V
Delay to Outpute td RL = 100 Q from DRAIN to Vcc VSOURCE = 1.5 V, See Figure 1 Room 100 200 ns
Pre-Regulator/Start-Up
Input Voltage +VIN IIN= 10 yA Room 120 V
Input Leakage Current +IIN Vcc10V Room 10 yA
Pre-Regulator Start-Up Current ISTART Pulse Width i 300 ys, Vcc = 7V Room 8 15 mA
Vcc Pre-Regulator Turn-Off Threshold Voltage VREG IPRE-REGULATOR = 10 yA Room 7.8 9.4 9.7 V
Undervoltage Lockout VUVLO RL= 100 Q from DRAIN to Vcc See Detailed Description Room 7.0 8.8 9.2
VREG, -VUVLO VDELTA Room 0.3 0.6
Supply
Supply Current lcc Room 0.45 0.6 1.0 mA
Bias Current IBIAS Room 10 15 20 yA
Logic
SHUTDOWN Delaye tSD VSOURCE = -VIN, See Figure 2 Room 50 100
SHUTDOWN Pulse Widthe tsw Room 50
RESET Pulse Widthe tRW See Figure3 Room 50 ns
Latching Pulse Widthe SHUTDOWN and RESET Low tLW Room 25
Input Low Voltage VIL Room 2.0 V
Input High Voltage VIH Room 8.0
Input Current Input Voltage High IIH VIN=10V Room 1 5
Input Current Input Voltage Low l|L VIN= OV Room -35 -25 yA
MOSFET Switch
Breakdown Voltage VBR(DSS) IDRAIN = 100 yA Full 200 220 V
Drain-Source On Resistancef DS(on) IDRAIN = 100 rTiA Room 7 Q
Drain Off Leakage Current IDSS VDRAIN = 100 V Room 5 10 VA
Drain Capacitance CDS Room 35 pF


Parameter Symbol Condition Min Typc Max Unit
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage BVDSS VGS:OyID:250yA 30 V
Zero Gate Voltage Drain Current IDSS VDS : 30V VGs : OV 1
Gate-Body Leakage IGSS VGS :+20V, VDS : OV +100 nA
ON CHARACTERISTICSb
Gate Threshold Voltage VGS(th) VDS:VGs ID:250htA 1 3 V
VGs : 10V, ID :7A 24 30 mQ
Drain-Source On-State Resistance RDS(ON) VGs :4.5V ID - 3.5A 32 42 mQ
On-State Drain Current ID(ON) VDS: 5V VGs: 10V 30 A
Forward Transconductance gFS VDS: 15V ID :7A 8 S
DYNAMIC CHARACTERISTICSc
Input Capacitance Ciss 804 PF
Output Capacitance Coss VDS:15V VGs: OV f:1.OMHz 328 PF
Reverse Transfer Capacitance CRSS 79 PF
SWITCHING CHARACTERISTICSc
Turn-On Delay Time IDfONl VDD : 25V 16 24 ns
Rise Time l ID : 1A VGs : lOV, 7 14 ns
Turn-Off Delay Time tD(OFF) RGEN:6Q 47 60 ns
Fall Time tf 10 15 ns
Total Gate Charge Qg 20 24 nC
Gate-Source Charge Qgs VDS :15V ID : 2A VGs :10V 3 nC
Gate-Drain Charge Qgd 6 nC