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PAL16P2VC Datasheet

Pin Name Pin Name Pin Name Pin Name
Al ENSEL C5 D48 Gll D35 Ll0 C28
A2 ENB2 C6 D44 G12 D36 Lll D20
A3 ENB3 C7 GND G13 D34 L12 D24
A4 D47 C8 VDD Hi S6 L13 D25
A5 D45 C9 C45 H2 S5 M1 Dlg
A6 D42 Cl0 C41 H3 VDD M2 D14
A7 D41 C11 C31 Hll GND M3 D11
A8 C410 C12 C33 H12 D38 M4 C110
A9 C48 C13 C36 H13 D37 M5 C17
A10 C46 Di S13 J1 S4 M6 C15
All C43 D2 S14 J2 S3 M7 C13
A12 C40 D3 OCEN J3 GND M8 C10
A13 C32 Dll C34 Jll D27 M9 C22
Bl ACC D12 C37 J12 D2g M10 C25
B2 FSEL D13 C3g J13 D3g M11 C2g
B3 ENB4 El S11 K1 S2 M12 D21
B4 D4g E2 S12 K2 S1 M13 D22
B5 D46 E3 GND K3 D18 Ni D16
B6 D43 Ell C38 Kll D23 N2 D13
B7 D40 E12 C310 K12 D26 N3 D10
B8 C4g E13 D30 K13 D28 N4 C18
B9 C47 F1 Sg Li so N5 C16
B10 C44 F2 Sl0 L2 D17 N6 C14
Bll C42 F3 VDD L3 D15 N7 C12
B12 C30 F11 D31 L4 D12 N8 C11
B13 C35 F12 D32 L5 Clg N9 C21
Cl S15 F13 D33 L6 GND Nl0 C23
C2 OEN Gl S7 L7 VDD Nll C26
C3 CLK G2 S8 L8 C20 N12 C27
C4 ENB1 G3 GND L9 C24 N13 C210


PAL16P2VC Price
Effective Resolution Bandwidth The highest input frequency where the SNR (dB) is dropped by 3 dB for a full-scale input amplitude. Total Harmonic Distortion (THD) THD is the ratio of the power of the fundamental (Ps) to the power of the first five harmonics (PD). THD - 10,og10 -S THD is typically given in units of dBc (dB to carrier). (3) Two-Tone Intermodulation Distortion IMD3 is the ratio of the power of the fundamental (at frequencies fi, f2) to the power of the worst spectral component at either frequency 2fi- f2 0r 2f2- fi). IMD3 is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converter's full-scale range.
PAL16P2VC on stock
Mounting This chips resistor is ideally suited for handling by automatic methods due to its rectangular shape and small dimensional tolerances. Electrical connection to a ceramic substrate or to a printed circuit board can be made by flow or reflow soldering of wraparound terminations. The terminations provide good 'leach' properties and ensure reliable contact. Due to the robust construction the resistor chip can be immersed in a solder bath for 10 seconds at 2600C. This enables the resistor to be mounted on one side of a printed circuit board and wire-leaded components on the other side.
Chapter l. Set Up and Operation 1.2 Using The Motor Control 3-Phase High Power Module ......... .................... 7 1.4 Detailed Description of Operation ...... .................. 17 1.7 User Signal Connector Pinout (37-Pin, D-Type) ........ .................. 37 Appendix A: Circuit Diagrams ..._... ..,...,.i,...,..,. 39