(1) Lead Forming . When forming leads, the leads should be bent at a point at least 3mm from the base of the epoxy bulb Do not use the base of the leadframe as a fulcrum during lead forming. . Lead forming should be done before soldering. . Do not apply any bending stress to the base of the lead. The stress to the base may damage the characteristics or it may break the LEDs. . When mounting the LEDs onto a printed circuit board, the holes on the circuit board should be exactly aligned with the leads of the LEDs. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.
PAL16R610BRA Price| Type | Marking | Ordering Code | Pin Conf | guratIOn | Package |
| BB 659 BB 659 | D D | Q62702-B0875 unmatched Q62702-B0854 inline matched | 1=C | 2=A | SCD-80 |
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PAL16R610BRA on stock| | | | | | | | 'GS |
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| VDS: | =10\; | | J | | | | |
| Puls | d | | | | | | |
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| | | r1 |
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