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PAL16R6A-4CNL Datasheet

Parameters 12TI-S08 Units Conditions
Tj Max.JunctionTemperatureRange -40t0125 oc
T<in Max.StorageTemperature Range stg -40t0125
RthjC Max.ThermaIResistancejunction to Case 1 5 oc/w DCoperation
RtrijA Max.ThermaIResistancejunction toAmbient 62
RthCS Typ.ThermaIResistanceCase toHeatsink 05 Mountingsurface,smoothandgreased
wt ApproximateWeight 2(0.07) g(oz)
T MountingTorque Min. 6(5) Kg-cm
Max. 12(10) (lbf-in)
Case Style T0-220AC


PAL16R6A-4CNL Price

Pulsed, 25QC _ *250C 11.:. 400C
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I LEO = 5mA, Forced Air ).
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PAL16R6A-4CNL on stock

y(2000rri m 2×0.8m m)
P W 108
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A single heat source, centered in the silicon chip is suspended across a cavity. Equally spaced aluminum/polysilicon thermopiles (groups of thermocouples) are located equidistantly on all four sides of the heat source (dual axis). Under zero acceleration, a temperature gradient is symmetrical about the heat source, so that the temperature is the same at all four thermopiles, causing them to output the same voltage.