| Part Numbert | Mfg | Packt | D/C | Descriptiont | Qty | Company/Contact |
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PAL18H6ANM Datasheet co The soldering temperature and time should not exceed 260IC for more than 10 seconds. co When shifting from preheating to soldering, the maximum temperature gradient should be 5IC or less. co After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. co Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. PAL18H6ANM Price
PAL18H6ANM on stock The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household ap- pliances). Consult our sales staff in advance for information on the following applications: . Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. . Any applications other than the standard applications intended. The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the prod- ucts, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifi- cations satisfy your requirements. Read Cycle Notes: 1. WE is high for read cycle. 2. All read cycle timing is referenced form the last valid address to the first transition address. 3. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit condition and are not referenced to VOH or VOL levels. 4. At any given temperature and voltage condition, tHZ(max) iS less than tLZ(min) both for a given device and from device to device 5. Transition is measured + 200mV from steady state voltage with Load(B). This parameter is sampled and not 100% tested. 6. Device is continuously selected with CS = VIL. 7. Address valid prior to coincident with CS transition low. 8. For common l/0 applications, minimization or elimination of bus contention condition is necessary during read and write cycle |
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