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PALC22V10H-15PC- Datasheet

iGENERAL SPECIFICATIONS
Tolerances Temperature Coefficient At OoC - 700C Noise Voltage Coefficient Thermal EMF
Absolute: 0.1% Ratio: 0.02% Absolute: 10 ppm Ratio: 2 ppm ·40dB 0.002 ppmN 0.1 pNIC
TWO EQUAL RESISTORS
R1 = R2
rW r w'i R1 = 1K: PN 209 50K: PN 214 2K: PN 210 100K: PN 215 5K: PN 211 200K: PN 216 10K: PN 212 500K: PN 217 20K: PN 213 1M: PN 218
u u u I I I a=TotaILength=0.316"Max. ActuaISizEa 1 2 3 b=SeatedHeight=0.260"Max. Except PN 218 where Seated Height = 0.342" Max,
1RATIO DIVIDER 10:1
Rl + R2 = 10K, 100K,1M
R =10 -R2- Rl R2 R1 + R2 = 10K: PN 280 = 100K: PN193 = 1M: PN 281
E rVW'rAA'i a = Total Length = 0.316" Max. ActuaISize 1 2 3 :x b = SeatExceptgPN 281.whereMSeated Height = 0.342" Max. lrr[Le~il~ OPERATIONAL AMPLIFIER FEEDBACK
A =10 R1 =100K,1M
R1 A= =io n< n^ R1 = 100K: PN 282 = 1M: PN 283
rrMl a TotaILength=0.316"Max. Actual Size b = S~xted Height = 0.260" Max. Except PN 283 where- Seated Height = 0.342" Max. l:[eilrm3ffiJ FOUR EaUAI_ P~c:fqTtlq
Rl = 1K, 10K, 100K
V-qtua, Size R1 - 1K: PN 329 = 10K: PN 158 = 100K: PN 288
Rl Rl Rl R1 a= 1 2 3 4 5 6 7 8 b:Total Length= 0.816M ed Height=0.260Max. _mq Ol'IiIamr


PALC22V10H-15PC- Price

CHARACTERISTIC SYMBOL RATING UNIT
DC Supply Voltage VCC - 0.513 V
Control Input Voltage VIN - 0.5VCC + 0.5 V
Swith l/0 Voltage VI/O - 0.5VCC + 0.5 V
Control Diode Current ICK ±20 mA
Output Diode Current llOK ±20 mA
Through I/O Current IT ±12_5 mA
DC VCC/Ground Current ICC ±25 mA
Power Dissipation PD 200 mW
Storage Temperature Tstg - 65150 C
Lead Temperature (10s) TL 260 oc


PALC22V10H-15PC- on stock

r70l
7 C7912A
f )cPC79 18A/ l
f 1
7 | |
f
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| lo = 5 mA
| CVo = Vo(TJ = 25 'C) - Vo(TJ)


1. Define the operating parameters for the circuit: . Ambient operating temperature range . Maximum telephone line operating current (highest battery and shortest copper loop) . Maximum operating voltage: (Maximum DC bias + peak ringing voltage) . Maximum surge current . System voltage damage threshold . Select device with an off-state voltage rating (VDRM) above the maximum operating voltage at the minimum operating temperature. 3. Select surge current ratings (IPPs and ITSM those which the application must withstand. 4. Verify that the minimum holding current of the device at the maximum ambient temperature is above the maximum dc current of the system. 5. Verify that the maximum breakover voltage of the device is below the system damage threshold. 6. Verify that the circuit's ambient operating temperatures are within the device's operating temperature range. 7. Verify that the device's dimensions fit the application's space considerations. 8. Independently evaluate and test the suitability and performance of the device in the application