PALC22V10L-25WI Datasheet| 29 ' 28 27 26 25 24 23 22 10 2I 11 20 12 19 13 18 14 17 15 16 |
PALC22V10L-25WI Price Extremely Rugged and Reliable - Built-in ECC support corrects 3 Bytes of error per 512 Byte sector Intelligent ATA/IDE Controller - Built-in microcontroller with intelligent firmware - Built-in Embedded Flash File System Power Management Unit - Immediate disabling of unused circuitry PALC22V10L-25WI on stock| PARAMETER | TEST CONDITIONS | MIN TYP MAX | UNIT | | | Low-K board(l), no airflow | D | 128 | | | Low-K board(l), no airflow | | 194.2 | | Junction-to-ambient thermal resistance, OJA | Low-K board(l), 150 LFM | 146.8 | oC/w | | Low-K board(l), 250 LFM | PW | 133.1 | | High-K board(2), no airflow | 121.6 | | | | D | 51 1 | | | Junction-to-board thermal resistance, OJB | High-K board(2) | PW | 85 3 | oC/w | | Junction-to-case thermal resistance, OJC | | D | 45 4 | | | PW | 34 7 | oC/w | | Device power dissipation, PD | EN = VCC, EN = GND, RL = 50 Q, Input 100 MHz 50 % duty cycle square wave to 1A:4A, TA = 850C | 288 5 | mW | | | | | |
| PART NO | d | | HLMP-XX10 | 12.37 + 0.25 (0.487 + 0.010) | | HLMP-XX17 | 12.42 + 0.25 (0.489 + 0.010) | | HLMP-XX26 | 12.52 + 0.25 (0.493 + 0.010) | | HLMP-XX32 | 11.96 + 0.25 (0.471 + 0.010) | | |
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