Features . Adoption of FBET process. . High DC current gain. . High VEBO (VEB0>25V). . High reverse hFE (150 typ). . Small ON resistance [Ron=l I (IB=5mA)]. . Very small-sized package permitting 2SC4695- applied sets to be made small and slim.
PALCE16V8Q-7PC Price| Symbol | Condition | Value | Units | Notes |
| VREF | Input reference voltage | 0.5+ VDDO | V | 1 |
| VSWING(MAX) | Input signal maximum peak to peak swing | 1O | V | 1 |
| SLEW | Input signal minimum slew rate | 1 0 | V/ns | 2 3 |
| | | | |
PALCE16V8Q-7PC on stock| JI | |
| IPP IBO IH IBR IDRM | l _J __j |
| | I I VBRI v VT I I VDRM VBO |
| |
| BODY SIZE | 13.Omm x 13.Omm | BODY SIZE |
| SYMBOL | MIN | NOM | MA× | NOTE |
| A | | | 1.50 | OVERALL THICKNESS |
| Ai | 0.40 | 0.50 | 0.60 | BALL HEIGHT |
| A2 | 0.60 | 0.75 | 0.90 | BODY THICKNESS |
| D | | 1 3.00 | | BOD SIZE |
| Di | 10.90 | 11.00 | 11.10 | BALL FOOTPRINT |
| E | | 13.00 | | BOD SIZE |
| Ei | 10.90 | 11.00 | 11.10 | BALL FOOTPRINT |
| M,N | 1 2 × 1 2 | BALL MATRI× |
| M 1A | 2 | NUMBER OF ROWS DEEP |
| b | 0.50 | 0.60 | 0.70 | BALL DIAM ETER |
| d | 0.5 | | | MIN DISTANCE ENCAP TO BALLS |
| e | 1.00 | BALL PITCH |
| aaa | | | 0.15 | PACKAGE BODY PROFILE |
| bbb | | | 0.10 | PARALLEL |
| ccc | | | 0.15 | ENCAP FLATNESS OVER DIE |
| ddd | | | 0.42 | COPLANARITY |
| S | | 0.50 | | SOLDER BALL PLACEMENT |
| T | 0.050 | 0.125 | 0.175 | V-SCORE WEB THICKNESS |
| v | 12.2 | | 12.9 | V-SCORE BOTTOM SIZE |
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