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Part Numbert Mfg Packt D/C Descriptiont Qty Company/Contact  
PALCE20RA10H-20   DIP  96+    14 
    A-RICH HK LECTRON CO.,LIMITED
  • Contact:JING ZHOU
  • Tel:86-755-33377586
  • Fax:86-755-33377578
  • Email: ARICH2@yahoo.cn



PALCE20RA10H-20 Datasheet
Recommended Wedge Bonding Procedure 1. Set the heater block temperature t0 260C +1- 10C 2. Use pre-stressed (annealed) gold wire between 0.0005 t0 0.001 inches in diameter. 3. Tip bonding pressure should be between 15 and 20 grams and should not exceed 20 grams. The footprint that the wedge leaves on the gold wire should be between l.5 and 2.5 wire diameters across for a good bond.
PALCE20RA10H-20 Price
Overvoltage and undervoltage comparators will pull the PGOOD output low if the output voltage comes out of regulation by +10%. In an overvoltage condition, the top powerMOSFETisturned offandthe bottom powerMOSFET is switched on until eitherthe overvoltage condition clears or the bottom MOSFET's current limit is reached.
PALCE20RA10H-20 on stock

Write Cycle Time twc 70 85 1 00 ns
Chip Selection to End of Write tcw 60 70 80 ns
Address Valid to End of Write tAW 60 70 80 ns
Address Setup Time tAS O O O ns
Write Pulse Width tWP 50 60 70 ns
Write Recovery Time tWR O O O ns
Data to Write Time Overlap tDW 30 35 40 ns
Output Active from End of Write tow 3 3 3 ns
Data Hold from Write Time tDH O O O ns
Write to Output High Z tWHZ O 25 O 25 O 30 ns


SYMBOL PARAMETER LIMITS UNIT
VEE Supply voltage range -7.0 to +0.5 V
VIN Input voltage (VIN should never be more negative than VEE) VEE t0 +0.5 V
lo Output source current (continuous) -100 mA
Ts Storage temperamre range -65 to150 ac
Tj Maximum junction temperature +150 oc