| SYMBOL | PARAMETER | ISL9N2357D3ST | UNITS |
| VDSS | Drain to Source Voltage (Note l) | 30 | V |
| VDGR | Drain to Gate Voltage (RGS = 20kl ) (Note l) | 30 | V |
| VGS | Gate to Source Voltage | +70 | V |
| ID ID IDM | Drain Current Continuous (TC = 250C, VGS = 10V) (Figure 2) Continuous (TC = 1000C, VGS = 10V) Pulsed Drain Current | 35 35 Figure 4 | A A A |
| PD | Power Dissipation Derate Above 250C | 100 0.67 | W w/oc |
| Tj, TSTG | Operating and Storage Temperature | -55 t0 175 | oc |
| TL Tpkg | Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s Package Body for 10s, See Techbrief TB334 | 300 260 | oc oc |
| THERMAL SPECIFICATIONS |
| ROJC | Thermal Resistance Junction to Case, T0-252 | 1.5 | oC/w |
| ROJA | Thermal Resistance Junction to Ambient T0-252 | 100 | oC/w |
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