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(1) Bending a lead should avoid not to cause chip deterioration or so. When bending is necessary, care must be taken considering the following points : Ol Bending a lead must be done before soldering. Bending a lead must be done in the states offixing a lead tight and applying no stress on the resin part; otherwise it may cause troubles such as gold wire breaking. A lead must be bent at intervals of l.6mm from the edge of the resin part. Do not bend the same portion oflead more than twice. (2) Setting a product by a tool such as holder should avoid. When necessary, no stress should be applied to the resin part and lead by sufficient considerations on dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board. (3) The hole pitch ofa circuit board must fit to its lead pitch. (4) When soldering, care must be taken considering the following points : Ol Do not heat a product under any stress (ex. : twist) to leads. Do not heat (by soldering, for example) a product in the states ofbeing forced to the resin part. (5) Do not use the flux containing chlorine which may cause corrosion oflead and washing is preferable. When washing is necessary, avoid washing the whole product and wash only the needed part under the following conditions. . Chemicals : Methyl alcohol . Temperature : 45IC max. . Time : 30sec. max.
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