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Part Numbert Mfg Packt D/C Descriptiont Qty Company/Contact  

Q67100-H6238 Datasheet
The circuit board used in the final application should use RF circuit design techniques. Signal lines should have 50 0hm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A sufficient number of VIA holes should be used to con- nect the top and bottom ground planes. The evalua- tion circuit board shown is available from Hittite upon request.
Q67100-H6238 Price

UNIT A Ai max. bp c D E e e1 HE Lp Q V W
mm 1 1 0 9 0 1 0 48 0 38 0 15 0 09 3 0 2 8 1 4 1 2 1 9 0 95 2 5 2 1 0 45 0 15 0 55 0 45 0 2 0 1


Q67100-H6238 on stock

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Description CE# OE# WE# A15 to A14 A13 to A10 A92 A8 A7 A6 A5 to A2 A1 AO DQ7 to DQO
Manufacturer ID: Eon L L H x x VID H1 x L x L L 1Ch
Device ID L L H x x VID x x L x L H 6Fh
Sector x VID x x L x H L Olh (Protected)
Protection Verification L L H SA OOh (Unprotected)