| Parameter | Symbol | Values | Unit |
| Mean forward current Soldering point, Ts = 80 0C, D = 0.5 | lrFAV | 3.5 | A |
| RMS forward current | IFRMS | 5.5 |
| Surge forward current Tj = 100 0C, 50-Hz sine halfwave, aperiodic | IFSM | 1 5 |
| Repetitive peak forward current TJ = 100 0C, tp " 10 ccs | IFRM | 35 |
| j2t value, TJ = 100 0C, tp = 10 ms | j2dt | 1.1 | A2s |
| Repetitive peak reverse voltage | VRRM | 1 000 | V |
| Surge peak reverse voltage | VRSM | 1 000 |
| Max. power dissipation, Soldering point Ts = 80 0C Ambient TA = 25 0C | Ptot | 1 0 1.8 | W |
| Operating and storage temperature range | TjTstg | - 40+150 | oC |
| Thermal resistance, chip-ambient | RthjA | 70.0 | K/W |
| Thermal resistance, chip soldering point | RthjS | 7.0 |
| DIN humidity category, DIN 40 040 | | E | |
| IEC climatic category, DIN IEC 68-1 | | 40/150/56 |
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