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QEDS8773 Datasheet

Intersil Space Level Product Flow - 'MS' Wafer Lot Acceptance (AlI Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method 2011 Sample - Die Shear Monitor, Method 2019 0r 2027 100% Internal Visual Inspection, Method 2010, Condition A 100% Temperature Cycle, Method 1010, Condition C, 10 Cycles 100% Constant Acceleration, Method 2001, Condition per Method 5004
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4. When the sector programming lockout feature is not enabled, the sector will erase (from the same sector erase command) Once the sector has been protected, data in the protected sectors cannot be changed unless the RESET pin is taken to 12V + 0.5V. 5. PA is the plane address (A18 - A16).
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Pin No.	Pin name	FunctIon
17	DAC	Expansion DAC (L / H)
18	SCV	Vol Cch shock sound integration
19	COUT	Cch output
20	LOUT	Lch output
21	CB	Cch Bass fc setting
22	CT	Cch Treble fc setting
23	LB	Lch Bass fc setting
24	LT	Lch Treble fc setting
25	STT	Treble shock sound integration
26	BGAIN	Bass Mix Gain adjustment
27	MSIN	Mono Sur input
28	BIN	Bass detection LPF operating amplifier input
29	ADD	L + R added output after AGC
30	CIN	Cch input
31	Vcc	Power supply, 9V
32	LIN	Lch input

Model	Temperature Range	Package Description	Package Option
ADV7202	OoC t0 700C	64-Lead Plastic Quad Flatpack (LQFP)	ST-64

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