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RPC12182J Datasheet

DESCRIPTION The ocPC8105GR is a sillicon monolithic integrated circuit designed as quadrature modulator for digital mobile communication systems. This modulator housed in a 16 pin plastic SSOP that is easy to install and contributes to miniaturizing the system. The device has power save function and can operates 2.7 t0 5.5 V supply voltage to realize low power consumption.
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			IF =5
	7
			= 10m

		IF=2	0 mA L
Normalized to IF = 10 mA TA = 25'C I

RPC12182J on stock

The supply current versus frequency and supply current versus capacitive load characteristic curves will aid in deter- mining power dissipation calculations. TeICom Semicon- ductor's CMOS drivers have greatly reduced quiescent DC power consumption. Input signal duty cycle, power supply voltage and load type, influence package power dissipation. Given power dissipation and package thermal resistance, the maximum ambient operating temperature is easily calculated. The 14- pin plastic package junction-to-ambient thermal resistance is 83.3YC/W. At +70IC, the package is rated at 800mW maximum dissipation. Maximum allowable chip tempera- ture is +150IC.

Characteristics	SYMBOL	MAX	UNIT
From Junction to Ambient	RtriO_a)	62.5	oC/W
From Junction to Case	Rtri(j_c)	1.56	oC/w

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