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SI4750DY Datasheet

Parameter	Test condition	Symbol	Min	Typ.	Max	Unit
Total flux	IF = 50 mA, RthjA = 200 0K/W	v	400	700	1250	mlm
Luminous intensity/Total flux	IF = 50 mA, RthjA = 200 0K/W	lv/+v		07		mcd/mlm
Dominant wavelength	IF = 50 mA, RthjA = 200 0K/W	d	492	505	510	nm
Peak wavelength	IF = 50 mA, RthjA = 200 0K/W	p		503		nm
Angle of half intensity	IF = 50 mA, RthjA = 200 0K/W	(p		±45		deg
Total included angle	90 % of Total Flux Captured	(p		100		deg
Forward voltage	IF = 50 mA, RmjA = 200 0K/W	VF		4.2	4.7	V
Reverse voltage	IR= 10 VA	VR	5	10		V
Junction capacitance	VR=O,t=1 MHz	ci		50		pF
Temperature coefficient of A,dom	IF= 30 mA	TCA,dom		O02		nm/K

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If the REAL-TONE pin is pulled low, the tone sfgnal will be output continuously. Otherwise, the tone output will be of minimum tone duration, tMFD, and will auto- matically follow an interdigit pause, tIDP. tMFD and tIDP are 101 ms in duration. R13 will reset t0 0000 0nce the tone signal is sent out, and can only be written after cleared to zero.
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Notes (al For a dual device surface mounted on 8 sq cm single sided 20z copper on FR4 PCB, in still air conditions with all exposed pads attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. (b) Measured at t<5 secs for a dual device surface mounted on 8 sq cm single sided 20z copper on FR4 PCB, in still air conditions with all exposed pads attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. (c) For a dual device surface mounted on 8 sq cm single sided 20z copper on FR4 PCB, in still air conditions with minimal lead connections only. (dl For a dual device surface mounted on 10 sq cm single sided loz copper on FR4 PCB, in still air conditions with all exposed pads attached attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. tel For a dual device surface mounted on 85 sq cm single sided 20z copper on FR4 PCB, in still air conditions with all exposed pads attached attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. (fl For a dual device with one active die. (gl For dual device with 2 active die running at equal power. (h) Repetitive rating - pulse width limited by max junction temperature. Refer to Transient Thermal Impedance graph. til The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device as shown in the package dimensions data. The thermal resistance for a dual device mounted on l.5mm thick FR4 board using minimum copper l oz weight, Imm wide tracks and one half of the device active is Rth = 2500C/W giving a power rating of Ptot = 500mW.

l	60	OmA
			400mA

			300mA
V	---		200mA
V	---
r			IB-1(	iOmA

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