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SI91822DB Datasheet
Insertion of the SNAPHAT housing after reflow prevents potential battery and crystal damage due to the high temperatures required for device sur- face-mounting. The SNAPHAT housing is keyed to prevent reverse insertion. The SOIC and battery/crystal packages are shipped separately in plastic anti-static tubes or in Tape & Reel form. For the 44 lead SOIC, the bat- tery/crystal package (i.e. SNAPHAT) part number is "M4TXX-BR12SH" (see Table 15).
SI91822DB Price

Package VMT3 EMT3 UMT3 SMT3 SPT
Packaging type laping Iaping laping [aping laping
Code T2L TL T106 T146 TP
Type Basic ordering unit (pieces) 8000 3000 3000 3000 5000
DTA123JM O
DTA123JE O
DTA123JUA O
DTA123JKA O
DTA123JSA O


SI91822DB on stock
Notes: 1. Measurements obtained from a test circuit described in Figure l. Input and output tuners tuned for maximum OIP3 while keeping VSWR better than 2:1 Data corrected for board losses. 2. 1) Output power level and frequency of two fundamental tones at l.9 GHz: Fl = 5.49 dBm, F2 = 5.49 dBm, Fl = 1.905 GHz, and F2 = 1.915 GHz. II) Output power level and frequency of two fundamental tones at 900 MHz: Fl = -0.38 dBm, F2 = -0.38 dBm, Fl = 905 MHz, and F2 = 915 MHz. 3. Standard deviation data are based on at least 500 pieces sample size taken from 8 wafer lots. Future wafers allocated to this product may have nomina values anywhere between the upper and lower spec limits.
*i All pins *2 All pins other than *6 *3 All input pins other than *6 *4 All output pins other than *s *s CLKO (Pin 14) *6 0CLK (Pin 11) *7 All pins other than *8 and #9 *8 Pins 54, 65, 66 and 75 t0 80 *9 Pin 55