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SIA0427 Datasheet

Typ~col S-Porameter Dta SII S2l Sl2 dB Ang dB Ang dB Ang -23.9 -165.2 12.4 0.B -25.4 6.6 -23.8 105.5 12.5 -12.8 -25.3 -2.4 -24.1 162.9 12.5 -30.1 -25.3 -10.5 -24.8 138.1 12.4 -61.6 -25.3 -23.5 -25.2 88.4 12.5 -123.6 -25.1 -48.9 -24.4 28.2 12.6 173.9 -24.9 -76.I -13.8 -35.1 12.6 112.2 -14.7 -104.3 -261 -85.0 12.4 51.0 -24.7 -135.0 -27.5 12.7 12.3 -9.2 -24.8 -167.4
SIA0427 Price

Characteristics	Symbol	Test Condition	Min	Typ	Max	Unit
Output voltage	VOUT	Please refer to the Output Voltage Accuracy table.
Line regulation	Reg- line	VOUT+1V<VIN<15V, IOUT = 1 mA		3	15	mV
Load regulation	Reg'load	1 mA < IOUT< 150 mA		25	75	mV
	IB1	IOUT=0mA		170
Quiescent current	IB2	IOUT= 50 mA		550	850	uA
Stand-by current	lB (OFF)	VCT= OV			O1	VA
Output noise voltage	VNO	IOUT = 10 mA, 10 Hz < f< 100 kHz, Ta = 25aC		30		FNrms
Temperature coefficient	Tcvo	-400C ' Topr < 85aC		100		ppm/oC
Input voltage	VIN		2.4		15	V
Ripple rejection	R.R.	IOUT = 10 mA, f= 1 kHz, VRipple = 500 mVp_p, Ta = 25aC		70		dB
Control voltage (ON)	VCT (ON)		1.5		VIN	V
Control voltage (OFF)	VCT (OFF)				0.4	V
Control current (ON)	ICT (ON)	VCT (ON) = 1.5 V		3	10	UA
Control current (OFF)	lCT(OFF)	VCT (OFF) = 0 V		O	O1	VA

SIA0427 on stock

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See supplements i 7.5 i			043-5220
fur 042-4900/ pou. f09rur 042-4901			043-5230

For the mounting process the SMD type package can be handled as a standard surface mount component. The use of either solder or conductive epoxy is possible. The solder thickness after reflow should be typical 50pm [2 mils] and the lateral alignment between the package and the motherboard should be within 50pm [2 mils]. Caution should be taken to obtain a good and reliable contact over the whole pad areas. Voids or other improper connections, in particular, between the ground pads of motherboard and package will lead to a deterioration of the RF performance and the heat dissipation. The latter effect can reduce drastically reliability and lifetime of the product.

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