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SIPN302.5LT Datasheet
T0-220 3-pin plastic flange-mount package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
SIPN302.5LT Price

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I I Duty Cycli I IIIII =0 5
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7 7 1 -l ti i-l t2 - 1. Duty Cycle:2D-I t, F J jr l__? 0.05 1 0.02
r ___-_ 2. Per Unit Base = RthjA = 80'C/W 3. TJM - TA = PDMZthjA(t) 4. Surface Mounted Singli Pulse l j
l l 10-3 10-2 l l l* 10-1 1 100


SIPN302.5LT on stock

Part number Organization 1/0 Freq. MHz RAS access time ns Package Mounted devices
MC-4R64FKE8S - 840 32M x18 800 40 160 edge connector pads SO-RIMM with heat spreader Edge connector: Gold plated 2 pieces ofpD488588FF FBGA (8GA') package


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