| Part Numbert | Mfg | Packt | D/C | Descriptiont | Qty | Company/Contact | |
| ST93C46MN6 | sgs | sgs | dc0 | 52 |
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| ST93C46MN6 | sgs | sgs | dc0 | 52 |
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| ST93C46MN6 | sgs | dc0 |
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| ST93C46MN6 | sgs | dc0 | INSTOCK!vpe:100/tube | 52 |
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| ST93C46MN6 | sgs | sgs | dc0 | 52 |
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ST93C46MN6 Datasheet The differential PECL data from TXIP, TXIN goes through a MLT3 Encoder. The MLT3 encoder is enabled when the TPMODE pin is LOW. The data is encoded per the follow- ing rules: The encoded output takes on one of three possible levels: High, Middle, or Low. Whenever the input signal changes state, the output will also change state. If the output is in the middle state, the state to which it will change to is dependent on the previous state. If the previous state was high(low), then the output will change to alow(high) state from the middle state. If the output is at either a high or a low state, then the next transition will cause the output to change to the middle state. The encoder conforms to the dia gram shown in Figure l. ST93C46MN6 Price
ST93C46MN6 on stock Genera I Description The HMC261LMl is a GaAs MMIC distributed amplifierin a SMT leadless chip carrier package covering 20 t0 32 GHz. The LMl is a true surface mount broadband millimeterwave pack- age offering low loss & excellent I/O match, preserving MMIC chip performance. Utilizing a GaAs PHEMT process the device offers 13 dB gain and +14 dBm saturated output power from a bias supply of +4V @ 75 mA. The packaged amplifierenables economical PCB SMT assem- bly for millimeterwave point-to-point radios, LMDS, and SATCOM applications. As an alter- native to chip-and-wire hybrid assemblies the HMC261LMl eliminates the need for wirebonding, thereby providing a consistent connection interface for the customer. All data is with the non-hermetic, epoxy sealed LMl pack- aged LNA device mounted in a 50 0hm test fixture. This part replaces the HMC261CBl by offering more bandwidth and gain.
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