| 1C L~AX ( PULSED)n.'I I I | II LL |
| | | I | | I J lN | L |
| I | C j | d | l I I l (CONT,NUO:S:- _ _ I l l l oj | |
| | | | ol | |
| | | | | IIII I IIJ IIII | | |
| | | | | I J l l I | | | |
| X s rNOLE. NONREPETITIVE | | |
| PULSE Te =:?r 5'C N - CURVES btUST BE DERATED LINEARLY WITH INCREASE - IN TEMPERATURE. I I I . ..l I I . r . F I il | | |
| | | | | | | |
Drain to Source Voltage (Note l) Drain to Gate Voltage (RGS = 20KI ) (Note l). Continuous Drain Current . . . . . . RMS Continuous . . . Pulsed Drain Current (Note 3) Gate to Source Voltage . . . . . . . . Maximum Power Dissipation . . . . Linear Derating Factor . . . . . . . Operating and Storage Temperature . . . . . . . . Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s Package Body for 10s, See Techbrief 334 . .