| | j^I¨| |
| | Economical surface mount design in both J-bend or Gull-wing terminations |
| | Available in both unidirectional and bidirectional construction (add C or CA suffix for bidirectional) |
| | Selections for 5.0 t0 170 volts standoff voltages (VWM) |
| | Suppresses transients up t0 600 watts @ 10/1000 ps (see Figure l) |
| | Fast response |
| | Options for screening in accordance with MIL-PRF- 19500 for JAN, JANTX, JANTXV, and JANS are available by adding MQ, MX, MV, or MSP prefixes respectively to part numbers. |
| | Axial-Iead equivalent packages for thru-hole mounting available as P6KE6.8 to P6KE200CA (consult factory for other surface mount options) |
| | Moisture classification is Level l with no dry pack required per IPC/JEDEC J-STD-020B ,J¨:IlTJLij,Jij^.Nlccd. |
| | Peak Pulse Power dissipation at 250C: 600 watts at |
| 10/1000 ps (also see Fig l,2, and 3). |
| | Impulse repetition rate (duty factor): 0.01% |
| | tclamping (0 volts to V(BR) rriiri.): < 100 ps theoretical for |
| unidirectional and < 5 ns for bidirectional |
| | Operating and Storage temperature: -650C to +1500C |
| | Thermal resistance: 25 0C/W junction to lead, or 900C/W |
| junction to ambient when mounted on FR4 PC board |
| (10z Cu) with recommended footprint (see last page) |
| | Steady-State Power dissipation: 5 watts at TL = 250C, |
| or l.38 watts at TA = 25 C when mounted on FR4 PC |
| board with recommended footprint |
| | Forward Surge at 25aC: 50 Amps peak impulse of 8.3 |
| ms half-sine wave (unidirectional only) |
| | Solder temperatures: 260 0C for 10 s (maximum) |
| |
VIN(max) iS the maximum input voltage, Vour(min) is the mirumum output voltage, Iour(max) is the maximum output current, for the application IQ is the maximum quiescent current at IOUT(max). A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air.
TMS320C6711PGEA120 on stock| | ¨¨L M LL- | |
| | ImL I[[ __rf r T | |
| __ | *ii | |
| - VD=8V =0VD=8V |
| L | | |
| | |
| TYPE | PACKAGE |
| NUMBER | NAME | DESCRIPTION | VERSION |
| TEA0675 | SDlP24 | plastic shrink dual in-line package; 24 leads (400 mil) | SOT234-1 |
| TEA0675T | S024 | plastic small outline package; 24 leads; body width 7.5 mm | SOT137-1 |
| | | |
