| Part Numbert | Mfg | Packt | D/C | Descriptiont | Qty | Company/Contact |
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TMS320VC5402PGE100G4 Datasheet The cycle-by-cycle current limit circuitry turns off the high-side MOSFET whenever the current in MOSFET reaches 2A. A second level current limit is accomplished by the undervoltage protection: if the load pulls the output volt- age down below 80% of its nominal value, the undervoltage latch protection will wait for a period of time (set by the capacitor at the LDELAY pin, see LDELAY CAPACITOR section for more information). If the output voltage is still below 80% of its nominal after the waiting period, the latch protection will be enabled. In the latch protection mode, the low-side MOSFET is on and the high-side MOSFET is off. The latch protection will also be enabled immediately when- ever the output voltage exceeds the overvoltage threshold (110% of its nominal). Both protections are disabled during start-up.(See SOFT-START CAPACITOR section and LDE- TMS320VC5402PGE100G4 Price The AAT3156 constant current sinks can drive six individual LEDs with a maximum current of 30mA per channel. The AS2Cwire serial interface enables the AAT3156 and sets the constant current sink magnitudes. AS2Cwire addressing allows the LED main channels Dl-D4 to be controlled independ- ently from the LED sub-channels D5-D6. TMS320VC5402PGE100G4 on stock package, ecs is the case to heat sink thermal resistance and OSA iS the heat sink to ambient thermal resistance. By adding additional copper area around the LM4871, the OJA can be reduced from its free air value of 1400C/W for package M08A. Depending on the ambient temperature, TA, and the OJA, Equation 2 can be used to find the maximum internal power dissipation supported by the lC packaging. If the re- sult of Equation l is greater than that of Equation 2, then ei- ther the supply voltage must be decreased, the load imped- ance increased, the OJA decreased, or the ambient temperature reduced. For the typical application of a 5V power supply, with an 8 1 load, and no additional heatsink- ing, the maximum ambient temperature possible without vio- lating the maximum junction temperature is approximately 610C provided that device operation is around the maximum power dissipation point and assuming surface mount pack- aging. Internal power dissipation is a function of output power. If typical operation is not around the maximum power dissipation point, the ambient temperature can be increased. Refer to the Typical Performance Characteristics curves for power dissipation information for different output powers and output loading.
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