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pal20r4102pc Datasheet

"The thermal resistance from the semiconductor die to ambient is typically 1200C/W when the S016 package is mounted on a PCB in free air. The power dissipation of the device when loaded must be designed to keep the device junction temperature below 1500C. *During power-up and power-down, these voltage ratings require an appropriate sequence of applying and removing signals and power supplies.
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3. A recovery time of minimum IUs is required before internal circuit gets Dec. 4. 2001 ready for any command sequences as shown in Figure 17. ---> A recovery time of minimum 10Us is required before internal circuit gets ready for any command sequences as shown in Figure 17.
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vJ eV 0.82	XTI 2	FC 0.5	Bv V 4.0	IBV A 1E-05	0.5 E-12	4	1.05	1E-11	0.05	0.26	1.43
					E	Alpha Industries, Inc. [781] 935-5150 . Fax [617] 824-4579 . Email sales@alphaind.com . www.alphaind.com Specifications subject to change without notice. 3lOOA

. Case: Molded Plastic . Terminals: Solder Plated Terminal - Solderable per MIL-STD-202, Method 208 . Polarity: Cathode Band or Cathode Notch . Approx. Weight: SMA 0.064 grams SMB 0.093 grams . Marking: Type Number

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		Exact Matc