rp111012a Price| | | | | | J | | | | tO | N V+= | 3V J | | I | | | | | | | | | | | | | | | | | ____ | _ | | | t01, - tOF | | | _ - | | | | | | t | | | _ | | | | 'UI\ - tOF | | | | | | | | | 'ur | | | | | | | | | | | | | | | | | rp111012a on stock GENERAL DESCRIPTION The 4 Meg x 16 DRAM is a high-speed CMOS, dynamic random-access memory device containing 67,1 0 8,8 64 bit s organized in a x16 con figuration. Th e MT4 LC 4 Ml 6F5 is fu n ction ally organized as 4,194,3 04 locations containing 16 bits each. The 4,194,304 m em ory lo cation s are arran ged in 4,0 9 6 rows by l,024 colu m n s. D u rin g READ or W RITE cycle s, each lo catio n is uniquely addressed via the address bits: 12 row- address bits (AO-A11) an d 10 column -address bit s (AO- A9). In addition, both byte and word accesses are supported via th e two CAS# pin s (CASL# an d CASH#). Th e CAS# functionality and timin g related to address an d con trol fu n ction s (e.g., latch in g colu m n addre sses or selecting CBR REFRESH) are such that the internal | Parameter | Symbol | Conditions | mi¨n | typ | max | Unit | | | ICBO | VCB = 10V,IE = 0 | | | 100 | nA | | Collector cutoff current | ICEO | VCE = 10V,IB = 0 | | | l | | | Collector to base | 2SC2405 | | | 35 | | | V | | voltage | 2SC2406 | VCBO | Ic = IOoA,IE = 0 | 55 | | | | Collector to emitter | 2SC2405 | | | 35 | | | V | | voltage | 2SC2406 | VCEO | Ic = 2niA,IB = o | 55 | | | | Emitter to base voltage | VEBO | IE = lOc~,IC = O | 5 | | | v | | Forward current transfer ratio | hFE* | VCB = SV, IE = -2mA | 180 | | 700 | | | Collector to emitter saturation voltage | VCE(sat) | Ic = lOOmA,IB = lOmA | | | 0.6 | v | | Base to emitter voltage | VBE | VCE = 1V,IC = lOOmA | | O7 | l | v | | Transition frequency | fT | VCB = SV, IE = -2mA, f= 200MHz | | 200 | | MHz | | Noise voltage | NV | VCE = 10V,IC = ImA, Gv = 80dB Rg = 100kl , Function = FLAT | | 110 | | mV | | | | | | | | | |